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WCBLF227L2031
  • image of Solder>WCBLF227L2031
  • image of Solder>WCBLF227L2031
Part number WCBLF227L2031
Product classification Solder
Manufacturer Canfield Technologies
description BLF 227 WATER S
Encapsulation -
Packing Spool
Quantity 49
RoHS 1
Inventory: 49
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$42.2280

$42.2280

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image of Solder>WCBLF227L2031
image of Solder>WCBLF227L2031
Part number
WCBLF227L2031
Product classification
Solder
Manufacturer
Canfield Technologies
BLF 227 WATER S
-
Spool
49
Product parameters
TYPEDESCRIPTION
MfrCanfield Technologies
Series-
PackageSpool
Product StatusACTIVE
Diameter0.031" (0.79mm)
Wire Gauge20 AWG, 22 SWG
CompositionBLF 227 (99.17Sn/.8Cu/.03Ni)
TypeWire Solder
Melting Point440°F (227°C)
FormSpool, 8 oz (227g), 1/2 lb
ProcessLead Free
Flux TypeWater Soluble
Storage/Refrigeration Temperature50°F ~ 104°F (10°C ~ 40°C)
Shelf Life StartDate of Manufacture
Shelf Life24 Months
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