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FORLINX-OKT507-C 152GSE8GIA10I11
  • image of Embedded MCU, DSP Evaluation Boards>FORLINX-OKT507-C 152GSE8GIA10I11
  • image of Embedded MCU, DSP Evaluation Boards>FORLINX-OKT507-C 152GSE8GIA10I11
Part number FORLINX-OKT507-C 152GSE8GIA10I11
Product classification Embedded MCU, DSP Evaluation Boards
Manufacturer Forlinx Embedded
description ARM DEVELOPMENT
Encapsulation -
Packing Tape & Box (TB)
Quantity 1
RoHS 1
Inventory: 1
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$198.0000

$198.0000

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image of Embedded MCU, DSP Evaluation Boards>FORLINX-OKT507-C 152GSE8GIA10I11
image of Embedded MCU, DSP Evaluation Boards>FORLINX-OKT507-C 152GSE8GIA10I11
Part number
FORLINX-OKT507-C 152GSE8GIA10I11
Product classification
Embedded MCU, DSP Evaluation Boards
Manufacturer
Forlinx Embedded
ARM DEVELOPMENT
-
Tape & Box (TB)
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
TypeMPU
ContentsBoard(s), Accessories
Core ProcessorARM® Cortex®-A53
Utilized IC / PartAllwinner T507
PlatformFORLINX-OKT507-C Development Board
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