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FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
Part number FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
Product classification Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Forlinx Embedded
description NXP i.MX8M Plus
Encapsulation -
Packing Tape & Box (TB)
Quantity 1
RoHS 1
Inventory: 1
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$157.2000

$157.2000

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image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
Part number
FORLINX-FETMX8MPQ-C 164GOE16(16G)IA10
Product classification
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Forlinx Embedded
NXP i.MX8M Plus
-
Tape & Box (TB)
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) 4 x 80 Pin
Size / Dimension2.441" L x 0.118" W (62.00mm x 32.00mm)
Speed1.6GHz
RAM Size4GB
Operating Temperature-40°C ~ 85°C
Module/Board TypeMPU
Core ProcessorARM® Cortex®-A53, ARM® Cortex®-M7
Flash Size16GB eMMC, 16MB (NOR)
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